DEEP-ER @ CeBIT

DEEP-ER and its predecessor project DEEP will be present at this year's CeBIT via Jülich Supercomputing Centre at Booth #C30/D29 in Hall 6.

Come by and get to know the innovative next-gen supercomputing architecture we propose, including a matching software stack. Learn how flexible the concept is and how beneficial it is for a very diverse group of HPC simulation applications from both academia and industry.

We will also showcase some of the innovative hardware we have developed within the project:

• The GreenICE Booster: This is an immersive-liquid cooled implementation of our DEEP Booster architecture developed by project partner University of Heidelberg. The electronic assemblies are immersed in a special high-tech liquid which evaporates even at moderate temperatures. The phase transition from liquid to gaseous maximizes the cooling effect.

• A Booster Node Card (BNC) with 2 Intel Xeon Phis and Coldplate: The Booster Node is the essential building block for the Eurotech Aurora Booster, the direct-liquid warm-water cooled implementation of the Booster Architecture. Its dense packaging allows for 384 Intel Xeon Phi cards in just one rack.

Looking forward to welcoming you in Hannover, Germany.